ABBA LINEAR TECH CO., LTD.
ABBA Linear guides - Critical components in Semiconductor processes
The ABBA BR Linear Guide Series is leading the semiconductor industry into a thriving new era. According to a research report from the SEMI International Semiconductor Industry Association, while the expansion rate of global 12-inch wafer production capacity is projected to be only 6% in 2023, it is expected to reach 8% in 2024 and achieve double-digit growth in 2025 and 2026. This indicates sustained global market momentum for long-term demand. With continued positive demand expectations, semiconductor equipment needs at various process stages are anticipated to gradually increase. ABBA Linear Tech's linear components stand out for their stability and low maintenance costs. As a key component in semiconductor equipment, ABBA enhances durability, further elevating production efficiency.
ABBA Semiconductor Industry Solutions - Wafer-dicing
Wafer dicing is a critical step in the semiconductor manufacturing process, where large wafers are diced into numerous small square or rectangular chips. Each chip becomes an individual semiconductor device. Precision dicing, often done using diamond blades, ensures high accuracy and smooth, scratch-free edges on the chips, facilitating further processing.
ABBA BR Ball Linear Guide - Movement of Wafer Dicing Blades | Application Benefits
▸Customizable rail Straightness
Due to the stringent precision requirements in wafer dicing, the BR Linear Guide can be customized according to specific specifications to ensure straightness during the cutting process. This customization ensures high accuracy and consistency, preventing deviations or irregular shapes in the resulting chips.
▸Smooth running
BR provides highly smooth running, reducing vibrations and impacts to ensure the surface quality of the wafer remains undamaged during the cutting process."
▸High Rigidity
BR possesses sufficient rigidity to withstand high loads and lateral forces during the cutting process. This helps ensure the stability of the cutting blades, preventing deviation from the required cutting trajectory and ensuring precision and quality in the cutting process.
ABBA Semiconductor Industry Solutions - Probe test
Probe testing is a crucial step in semiconductor manufacturing for validating and testing the functionality of semiconductor chips. Using tiny probes to establish electrical connections, electrical signals are applied to test specific functions such as logic, storage, and communication. This process helps detect potential manufacturing defects such as short circuits, open circuits, or functional faults, ensuring that each chip meets design specifications and quality standards before proceeding to the next manufacturing stage.
ABBA BM Miniature Linear Guide - Movement of the Probe Head | Application Benefits
▸High Stability
"The high stability of BM ensures repeatability and accuracy in the testing process, preventing unintended movement or vibration of the probe head beyond the designated travel, maintaining the consistency of tests."
▸High Positioning Accuracy
"Probe testing requires precise positioning of small probes to the pins and test points on the chip. BM's high positioning accuracy ensures that the probe head contacts the test points accurately, allowing for precise measurement and verification of the chip's functionality. This helps avoid errors that could lead to incorrect measurement results."
▸Up to 20,000km of Maintenance-Free
"BM's self-lubricating oil-retaining felt ensures lubrication conditions in the system, eliminating the need for frequent maintenance. This reduces the risk of production interruptions and enhances overall production efficiency."
ABBA Semiconductor Industry Solutions - Wafer-bonding
Wafer bonding is a crucial process that involves connecting semiconductor wafers to other electronic components or packaging materials. Bonding material is typically applied in the form of coatings or layers on the wafers. By bringing the wafers into close contact and applying heat and pressure, the bonding material forms a secure connection, facilitating electrical connections and integration
ABBA Ball screw - Movement of the Inspection Head | Application Benefits
▸High speed
The high-speed motion characteristics of ABBA ball screws allow the rapid movement of the welding head to the target position, enabling efficient and swift wafer bonding.
▸High Positioning Accuracy
Wafer bonding requires precise position control, and the excellent positioning accuracy of ABBA ball screws ensures the welding head is precisely aligned with the bonding points. This helps prevent welding deviations and enhances the overall quality of the bonding process.
▸Low noise
Low-noise sports help reduce the noise level in the production environment, reduce noise interference during the process, and improve the quality of the working environment.。
ABBA Semiconductor Industry Solutions - Automated Optical Inspection
In semiconductor manufacturing, automated optical inspection utilizes machine vision for non-contact defect detection, dimension and shape measurement, surface quality checks, and other inspections. This reduces human inspection errors, efficiently and accurately confirming the quality, integrity, and performance of semiconductor components.
ABBA BM Miniature Linear Guide - Movement of the Inspection Head | Application Benefits
▸Outstanding Dust Protection Performance
Optical inspection equipment is highly sensitive to contaminants. The BM (Ball Screw) exhibits optimized sealing performance, effectively preventing dust and impurities from entering the guide system, ensuring cleanliness of optical components, and enhancing inspection precision.
▸Quick and Safe Assembly
Anti-drop Ball Retention system in BM ensures easy assembly, quick and secure, reducing downtime and enhancing production efficiency.
▸Silent, Smooth and Precision Motion
BM provides quiet and smooth motion with highly precise transmission, ensuring accurate positioning of the inspection head and enhancing the accuracy and consistency of inspections.
ABBA Linear Tech provides unparalleled solutions in various critical areas of the semiconductor process, ensuring high quality and reliability. The outstanding performance of ABBA BR Ball Linear Guides, BM Miniature Linear Guides, and Ball Screws in semiconductor cutting, testing, welding, and optical inspection processes makes them an ideal choice. These advantages enhance production efficiency, ensure process precision, and reduce maintenance needs. ABBA offers robust support for the challenging demands of the semiconductor industry.。